【Invited Talk】IC Packaging Simulation Analysis and Application

●Topic: IC Packaging Simulation Analysis and Application
●Speaker: 科盛科技(Moldex3D)沈立軒經理
●Time: 2022/12/30(五) 13:30-14:30
● Hybrid Events:
  Venue: MK Innovation Hall 3rd floor Center Office
  Links: https://ntucc.webex.com/meet/pjwang02